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In semiconductor manufacturing, the 3 nm process is the next die shrink after the 5 nm MOSFET technology node. South Korean chipmaker Samsung started shipping its 3 nm gate all around (GAA) process, named 3GAA, in mid-2022. On 29 December 2022, Taiwanese chip manufacturer TSMC announced that volume production using its 3 nm semiconductor node (N3) was underway with good yields. An enhanced 3 nm chip process called "N3E" may have started production in 2023. American manufacturer Intel planned to start 3 nm production in 2023.
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